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 Single Line TVS Diode for ESD Protection in Portable Electronics
PROTECTION PRODUCTS Description
The SDxxC TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxxC series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. The SDxxC is in a SOD-323 package and will protect one bidirectional line. They are available with working voltages of 5 - 24 volts. These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be sprinkled around the board in applications where board space is at a premium. They may may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge).
SD05C THRU SD24C
PRELIMINARY
Features
u 350 Watts peak pulse power (tp = 8/20s) u Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20s) Small package for use in portable electronics Suitable replacement for MLVs in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V, 12V, 15V, 24V Low leakage current Solid-state silicon avalanche technology
u u u u u u u u u u u u u u u u u u
Mechanical Characteristics
EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel per EIA 481
Applications
Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDAs) Notebooks, Desktops, & Servers Portable Instrumentation Pagers Peripherals
Schematic & PIN Configuration
1
2
SOD-323 (Top View)
Revision 9/2000
1
www.semtech.com
SD05C THRU SD24C
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Pow er (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD Voltage (HBM Waveform p er IEC 61000-4-2) Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbo l Pp k I PP V PP TL TJ TSTG Value 350 24 30 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A kV C C C
Electrical Characteristics
SD05C T VS fo r 5V Line s Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l V RWM V BR IR VC VC Cj It = 1mA VRWM = 5V, T=25C IPP = 5A, tp = 8/20s IPP = 24A, tp = 8/20s V R = 0V, f = 1MHz 6 10 9.8 14.5 200 Co nd itio ns Minimum Typ ical Maximum 5 Units V V A V V pF
SD12C T VS fo r 12V Line s Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l V RWM V BR IR VC VC Cj It = 1mA VRWM = 12V, T=25C IPP = 5A, tp = 8/20s IPP = 15A, tp = 8/20s VR = 0V, f = 1MHz 13.3 1 19 24 100 Co nd itio ns Minimum Typ ical Maximum 12 Units V V A V V pF
a 2000 Semtech Corp.
2
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SD05C THRU SD24C
PROTECTION PRODUCTS Electrical Characteristics (Continued)
SD15C T VS fo r 15V Line s Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l V RWM V BR IR VC VC Cj It = 1mA VRWM = 15V, T=25C IPP = 5A, tp = 8/20s IPP = 12A, tp = 8/20s V R = 0V, f = 1MHz 16.7 1 24 29 75 Co nd itio ns Minimum Typ ical Maximum 15 Units V V A V V pF
PRELIMINARY
SD24C T VS fo r 24V Line s Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l V RWM V BR IR VC VC Cj It = 1mA VRWM = 24V, T=25C IPP = 5A, tp = 8/20s IPP = 8A, tp = 8/20s VR = 0V, f = 1MHz 26.7 1 40 44 50 Co nd itio ns Minimum Typ ical Maximum 24 Units V V A V V pF
a 2000 Semtech Corp.
3
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SD05C THRU SD24C
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
110
Power Derating Curve
Peak Pulse Power - PPP (kW)
100
1
% of Rated Power or IPP
90 80 70 60 50 40 30 20 10
0.1
0.01 0.1 1 10 Pulse Duration - tp ( s) 100 1000
0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC)
Pulse Waveform
110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2 e
-t
Clamping Voltage vs. Peak Pulse Current
30
Waveform Parameters: tr = 8s td = 20s
Clamping Voltage - Vc (V)
25 20 15 10 5 0 0
Waveform Parameters: tr = 8s td = 20s
SD12C
SD05C
5
10
15
20
25
30
Peak Pulse Current -Ipp (A)
a 2000 Semtech Corp.
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SD05C THRU SD24C
PROTECTION PRODUCTS Applications Information PRELIMINARY
Device Schematic & Pin Configuration
Device Connection Options
The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information):
l l l l
Size Comparison to 0805 MLV
l l l l l
Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS & decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane.
SOD-323 Note: Nominal dimensions in inches
0805 MLV
Component Placement Comparison
0805 MLV on 0805 Solder Pad
SOD-323 on 0805 MLV Pad
SOD-323 on Recommended (SOD-323) Solder Pad
a 2000 Semtech Corp.
5
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SD05C THRU SD24C
PROTECTION PRODUCTS Outline Drawing - SOD-323
Land Pattern - SOD-323
a 2000 Semtech Corp.
6
www.semtech.com
SD05C THRU SD24C
PROTECTION PRODUCTS Marking Codes
Par t Numbe r SD05C SD12C SD15C SD24C Mar king Co d e 5/5 6/6 7/7 8/8
PRELIMINARY
Ordering Information
P ar t Numbe r SD05C.TC SD05C.TG SD12C.TC SD12C.TG SD15C.TC SD15C.TG SD24C.TC SD24C.TG Wo r king Vo ltage 5V 5V 12V 12V 15V 15V 24V 24V Qty p e r Reel 3,000 10,000 3,000 10,000 3,000 10,000 3,000 10,000 R e e l Size 7 13 7 13 7 13 7 13
Contact Information
Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804
a 2000 Semtech Corp. 7 www.semtech.com


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